? semiconductor components industries, llc, 2004 july, 2004 ? rev. 3 1 publication order number: BCW68GLt1/d BCW68GLt1 general purpose transistor pnp silicon features ? pb?free package is available maximum ratings rating symbol value unit collector?emitter voltage v ceo ?45 vdc collector?base voltage v cbo ?60 vdc emitter?base v oltage v ebo ?5.0 vdc collector current ? continuous i c ?800 madc maximum ratings are those values beyond which device damage can occur. maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. if these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be af fected. thermal characteristics characteristic symbol max unit total device dissipation fr?5 board (note 1) t a = 25 c derate above 25 c p d 225 1.8 mw mw/ c thermal resistance, junction?to?ambient r ja 556 c/w total device dissipation alumina substrate (note 2) t a = 25 c derate above 25 c p d 300 2.4 mw mw/ c thermal resistance, junction?to?ambient r ja 417 c/w junction and storage temperature t j , t stg ?55 to +150 c 1. fr?5 = 1.0 0.75 0.062 in. 2. alumina = 0.4 0.3 0.024 in 99.5% alumina. sot?23 case 318 style 6 http://onsemi.com dg = specific device code m = date code marking diagram 1 2 3 device package shipping 2 ordering information BCW68GLt1 sot?23 3000 / tape & reel BCW68GLt1g sot?23 (pb?free) 3000 / tape & reel 2for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. dg m 3000 / tape & reel collector 3 1 base 2 emitter
BCW68GLt1 http://onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristic symbol min typ max unit off characteristics collector?emitter breakdown voltage (i c = ?10 madc, i b = 0) v (br)ceo ?45 ? ? vdc collector?emitter breakdown voltage (i c = ?10 adc, v eb = 0) v (br)ces ?60 ? ? vdc emitter?base breakdown voltage (i e = ?10 adc, i c = 0) v (br)ebo ?5.0 ? ? vdc collector cutoff current (v ce = ?45 vdc, i e = 0) (v ce = ?45 vdc, i b = 0, t a = 150 c) i ces ? ? ? ? ?20 ?10 nadc adc emitter cutoff current (v eb = ?4.0 vdc, i c = 0) i ebo ? ? ?20 nadc on characteristics dc current gain (i c = ?10 madc, v ce = ?1.0 vdc) (i c = ?100 madc, v ce = ?1.0 vdc) (i c = ?300 madc, v ce = ?1.0 vdc) h fe 120 160 60 ? ? ? 400 ? ? ? collector?emitter saturation voltage (i c = ?300 madc, i b = ?30 madc) v ce(sat) ? ? ?1.5 vdc base?emitter saturation voltage (i c = ?500 madc, i b = ?50 madc) v be(sat) ? ? ?2.0 vdc small?signal characteristics current?gain ? bandwidth product (i c = ?20 madc, v ce = ?10 vdc, f = 100 mhz) f t 100 ? ? mhz output capacitance (v cb = ?10 vdc, i e = 0, f = 1.0 mhz) c obo ? ? 18 pf input capacitance (v eb = ?0.5 vdc, i c = 0, f = 1.0 mhz) c ibo ? ? 105 pf noise figure (i c = ?0.2 madc, v ce = ?5.0 vdc, r s = 1.0 k , f = 1.0 khz, bw = 200 hz) n f ? ? 10 db
BCW68GLt1 http://onsemi.com 3 package dimensions sot?23 (to?236) case 318?08 issue aj mm inches scale 10:1 0.8 0.031 0.9 0.035 0.95 0.037 0.95 0.037 2.0 0.079 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* d j k l a c b s h g v 3 1 2 dim a min max min max millimeters 0.1102 0.1197 2.80 3.04 inches b 0.0472 0.0551 1.20 1.40 c 0.0350 0.0440 0.89 1.11 d 0.0150 0.0200 0.37 0.50 g 0.0701 0.0807 1.78 2.04 h 0.0005 0.0040 0.013 0.100 j 0.0034 0.0070 0.085 0.177 k 0.0140 0.0285 0.35 0.69 l 0.0350 0.0401 0.89 1.02 s 0.0830 0.1039 2.10 2.64 v 0.0177 0.0236 0.45 0.60 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 318?03 and ?07 obsolete, new standard 318?08. style 6: pin 1. base 2. emitter 3. collector
BCW68GLt1 http://onsemi.com 4 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. atypicalo parameters which may be provided in scillc data sheets and/or specifications can and do vary in different a pplications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for each customer application by customer's technical e xperts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc prod uct could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indem nify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was neglig ent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800?282?9855 toll free usa/canada japan : on semiconductor, japan customer focus center 2?9?1 kamimeguro, meguro?ku, tokyo, japan 153?0051 phone : 81?3?5773?3850 BCW68GLt1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 61312, phoenix, arizona 85082?1312 usa phone : 480?829?7710 or 800?344?3860 toll free usa/canada fax : 480?829?7709 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : http://onsemi.com order literature : http://www.onsemi.com/litorder for additional information, please contact your local sales representative.
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